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Extending Moore's Law through Advanced Semiconductor Design and Processing Techniques
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Extending Moore's Law through Advanced Semiconductor Design and Processing Techniques

This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics. The research presented in this book provides essential background and knowledge to grasp the following principles:







  • Traditional and modern photolithography, the primary limiting factor of Moore’s law






  • Innovations in semiconductor manufacturing that makes current generation CMOS processing possible






  • Multi-disciplinary technologies that could drive Moore''s law forward significantly






  • Design principles for microelectronic circuits and components that take advantage of technology miniaturization






  • The semiconductor industry economic market trends and technical driving factors




The complexity and cost associated with technology scaling have compelled researchers in the disciplines of engineering and physics to optimize previous generation nodes to improve system-on-chip performance. This is especially relevant to participate in the increased attractiveness of the Internet of Things (IoT). This book additionally provides scholarly and practical examples of principles in microelectronic circuit design and layout to mitigate technology limits of previous generation nodes. Readers are encouraged to intellectually apply the knowledge derived from this book to further research and innovation in prolonging Moore’s law and associated principles.

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This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics. The research presented in this book provides essential background and knowledge to grasp the following principles:







  • Traditional and modern photolithography, the primary limiting factor of Moore’s law






  • Innovations in semiconductor manufacturing that makes current generation CMOS processing possible






  • Multi-disciplinary technologies that could drive Moore''s law forward significantly






  • Design principles for microelectronic circuits and components that take advantage of technology miniaturization






  • The semiconductor industry economic market trends and technical driving factors




The complexity and cost associated with technology scaling have compelled researchers in the disciplines of engineering and physics to optimize previous generation nodes to improve system-on-chip performance. This is especially relevant to participate in the increased attractiveness of the Internet of Things (IoT). This book additionally provides scholarly and practical examples of principles in microelectronic circuit design and layout to mitigate technology limits of previous generation nodes. Readers are encouraged to intellectually apply the knowledge derived from this book to further research and innovation in prolonging Moore’s law and associated principles.

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Produktdetaljer
Sprog: Engelsk
Sider: 366
ISBN-13: 9781032653136
Indbinding: Paperback
Udgave:
ISBN-10: 1032653132
Udg. Dato: 25 jun 2024
Længde: 0mm
Bredde: 234mm
Højde: 156mm
Oplagsdato: 25 jun 2024
Forfatter(e) Jassem Ahmed Abdallah, Wynand Lambrechts, Jaco Prinsloo, Saurabh Sinha


Kategori Elektronik: kredse og komponenter


Sprog Engelsk


Indbinding Paperback


Sider 366


Udgave


Længde 0mm


Bredde 234mm


Højde 156mm


Udg. Dato 25 jun 2024


Oplagsdato 25 jun 2024

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